Position Description

At Dynetics, our mission is to reach, equip, and teach students with an interest in the field of defense and aerospace. Running for over two decades, the summer internship program has been a staple at Dynetics, giving interns hands-on experience in their future career path. With no shortage of work available, interning with Dynetics promises growth, experience, and unrivaled opportunity across the US.

The Product Engineering Department is a design-focused group of engineers specializing in advanced hardware-based solutions. The individual selected for internship will be a design engineering student with varied technical interests and demonstrated engineering skills in their academic setting. The individual will learn and grow their ability to solve challenging technical problems focused on embedded systems. The engineering student will work closely with embedded systems integrated into a diverse range of aerospace and military systems including manned/unmanned ground/air vehicles, missiles, defensive radars, and space systems.

The selected candidate will be have an opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. The engineer student may be responsible for implementing, and testing embedded hardware and firmware on a variety of platforms including FPGAs, microcontrollers, microprocessors, and mixed signal designs.  Additional learning opportunities related to digital-signal processing (DSP) design, printed circuit board (PCB) design, experience with technical trade studies, and evaluation of technology improvements will be provided to the engineering student through this internship. 

The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.

The intern working in this area will develop significant experience in the following areas:

• C, C++, VHDL, Verilog, assembly
• Communication protocols such as: UART, Ethernet, SPI, I2C, CAN bus, etc.
• Hands-on laboratory experience with instrumentation, test equipment, and debug/test methods
• Perform in a collaborative engineering environment working closely with multi-disciplinary teams
• Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream) 
• RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
• Memory architectures, types, and caching
• GNU/Linux and developing kernel drivers
• Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, uC/OS-II)

Basic Qualifications

• Candidate must be working towards a Bachelors, Masters, or PhD in the related field.
• Candidate must have a GPA of 3.0 or higher.
• Candidate must upload a resume and unofficial transcripts along with application.

Other Qualifications

Security Requirements

Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance or meet the eligibility to obtain (and maintain) a Secret Clearance.

Job Number:

01.01.02-2023-32

Closing Date:

12/08/2023