Aerospace Engineer

Dayton, OH |Full Time
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Position Description

Dynetics, a wholly owned subsidiary of Leidos, is seeking a talented Aerospace Engineer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Dynetics provides responsive, cost-effective engineering, scientific and IT solutions. 

Dynetics Dayton Office is seeking Aerospace, Electrical, Mechanical, and Computer Engineers, and Computer Scientists with experience in the modeling & simulation (M&S) of, aerospace systems, to include air-launched weapons, space and counterspace systems, and ballistic missile systems; to include their related support systems and sensors. Opportunities will also be available for engineers with experience in flight-dynamics, orbital mechanics, state-estimation, and command-and-control modeling.

 

 

Basic Qualifications

  • Position will require a Bachelor's (or Master's) Degree in Electrical, Aerospace, Mechanical, or Computer Engineering, Computer Science, or a closely related field and two years of relevant work history is required.
  • Applicant must demonstrate good people skills and the desire to work with a highly technical team of engineers and scientists. 
  • An MS degree in a relevant field can be used in lieu of 2 years of experience.
  • Experience in supporting the Scientific and Technical Intelligence community (NASIC, MSIC, ONI, NGIC) is a plus. Modeling experience with MATLAB and/or Simulink is also a plus.
  • Applicant must have good people skills and the desire to work with a highly technical team of engineers and scientists.

Candidate must be a resident of the Dayton, OH area or be willing to relocate to the Dayton, OH area.

 

Other Qualifications

Security Requirements

Candidate must be a US Citizen and possess (and be able to maintain) a Final Top Secret/SSBI Clearance or meet the eligibility to obtain (and maintain) a Final Top Secret Clearance.

Job Number:
01.01.08-2023-67
Closing Date:
12/11/2023

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