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Dynetics, a wholly owned subsidiary of Leidos, is seeking a talented Senior Printed Circuit Board (PCB) Layout Designer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.
The Product Engineering Department is a design-focused group specializing in advanced hardware products. The individual selected for this position must be a self-starter with strong technical skills and demonstrated experience working with inter-disciplinary teams to solve challenging technical problems. The individual will design PCBs that will be integrated into a diverse range of aerospace and military systems including manned/unmanned ground/air vehicles, missiles, defensive radars, and space systems.
The Senior PCB Layout Designer will be expected to execute in a fast-paced, small team environment to develop robust hardware solutions. The designer’s primary job functions include working with electrical and mechanical engineers to select materials, define stack-up, and specify necessary physical and electrical constraints for multi-layer PCB designs. This includes part placement in a 3D environment, signal routing, and compliance employing a rules-driven design methodology necessary to achieve a highly integrated custom solution.
With a product focus, the individual is also expected to actively partner with engineers, project managers, technicians, and the customer to develop solutions that adhere to a diverse set of requirements. The designer will analyze and understand constraints impacting the electro-mechanical design and develop effective PCB solutions. Additionally, the designer will support resolution of technical issues that are discovered during the manufacture and test of deliverable hardware.IND2
Candidate must have a minimum of ten (10) years experience with electronic CAD software.
Candidate must have experience with a PCB Layout software suite (Mentor Graphics, Altium, Cadence/Allegro, Other).
Candidate must have demonstrated knowledge of IPC requirements necessary to design and document Rigid, Rigid-Flex and Flex type designs.
Candidate must have demonstrated knowledge of via structure types necessary to effectively implement Blind, Buried and HDI structures in any combination.
Candidate must have demonstrated knowledge of material types and experience working with PCB suppliers to build stackups to meet design requirements.
Candidate must have demonstrated knowledge of DFM guidelines ensuring the manufacturability of PCB designs.
Candidate must demonstrate knowledge of digital/analog/RF design requirements and techniques using constraint manager to drive layout and DRC verification.
Candidate must demonstrate knowledge of electrical and physical constraint definition and effective layout of DDR, LVDS, PCI-E, or other high speed SE/DIFF interfaces requiring inter/intra related hierarchical group matching and phase matching techniques.
Candidate must demonstrate competence with mechanical 2D/3D CAD application necessary for effective ECAD/MCAD data exchange.
Candidate must have demonstrated experience effectively communicating within a team environment.
Candidate must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area.
Preference will be shown to candidates who possess an Associate’s Degree in Electronics or CAD.
Preference shown to candidates who have experience and/or working knowledge of:
Candidate must be a US Citizen.
Candidate must possess (and be able to maintain) a Final Secret Clearance or meet the eligibility to obtain (and maintain) a Secret Clearance.