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Dynetics, a wholly owned subsidiary of Leidos, is seeking a talented Senior Printed Circuit Board (PCB) Layout Designer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.
The Product Engineering Department is a design-focused group specializing in advanced hardware products. The individual selected for this position must be a self-starter with strong technical skills and demonstrated experience working with inter-disciplinary teams to solve challenging technical problems. The individual will design PCBs that will be integrated into a diverse range of aerospace and military systems including manned/unmanned ground/air vehicles, missiles, defensive radars, and space systems.
The Senior PCB Layout Designer will be expected to execute in a fast-paced, small team environment to develop robust hardware solutions. The designer’s primary job functions include working with electrical and mechanical engineers to select materials, define stack-up, and specify necessary physical and electrical constraints for multi-layer PCB designs. This includes part placement in a 3D environment, signal routing, and compliance employing a rules-driven design methodology necessary to achieve a highly integrated custom solution.
With a product focus, the individual is also expected to actively partner with engineers, project managers, technicians, and the customer to develop solutions that adhere to a diverse set of requirements. The designer will analyze and understand constraints impacting the electro-mechanical design and develop effective PCB solutions. Additionally, the designer will support resolution of technical issues that are discovered during the manufacture and test of deliverable hardware.
-Candidate must have a minimum of ten (10) years experience with electronic CAD software.
-Candidate must have experience with a PCB Layout software suite (Mentor Graphics, Altium, Cadence/Allegro, Other).
-Candidate must have demonstrated knowledge of IPC requirements necessary to design and document Rigid, Rigid-Flex and Flex type designs.
-Candidate must have demonstrated knowledge of via structure types necessary to effectively implement Blind, Buried and HDI structures in any combination.
-Candidate must have demonstrated knowledge of material types and experience working with PCB suppliers to build stackups to meet design requirements.
-Candidate must have demonstrated knowledge of DFM guidelines ensuring the manufacturability of PCB designs.
-Candidate must demonstrate knowledge of digital/analog/RF design requirements and techniques using constraint manager to drive layout and DRC verification.
-Candidate must demonstrate knowledge of electrical and physical constraint definition and effective layout of DDR, LVDS, PCI-E, or other high speed SE/DIFF interfaces requiring inter/intra related hierarchical group matching and phase matching techniques.
-Candidate must demonstrate competence with mechanical 2D/3D CAD application necessary for effective ECAD/MCAD data exchange.
-Candidate must have demonstrated experience effectively communicating within a team environment.
-Candidate must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area.
Preference will be shown to candidates who possess an Associate’s Degree in Electronics or CAD.
Preference shown to candidates who have experience and/or working knowledge of:
Candidate must be a US Citizen.
Candidate must possess (and be able to maintain) a Final Secret Clearance or meet the eligibility to obtain (and maintain) a Secret Clearance.